Introducing our exceptional hybrid PCB, combining the advanced features of Rogers RO4003C and Shengyi S1000-2 materials. This meticulously crafted PCB offers outstanding electrical performance, low loss, and cost-effectiveness, making it an ideal choice for a wide range of applications, including point-to-point digital radio antennas, cellular base station antennas, automotive radar systems, and much more.
RO4003C Features:
RO4003C laminates from Rogers are proprietary woven glass reinforced hydrocarbon/ceramic materials designed to deliver exceptional electrical performance and manufacturability. Key features include:
- Tight Control on Dielectric Constant: RO4003C ensures precise control of dielectric constant (Dk) with a value of 3.38 +/- 0.05, providing reliable signal transmission.
- Low Loss Tangent: With a dissipation factor of 0.0027 at 10 GHz, RO4003C minimizes signal loss and exhibits excellent high-frequency performance.
- Low Z-Axis CTE: RO4003C showcases a low coefficient of thermal expansion (CTE) of 46 ppm/°C in the Z-axis, ensuring outstanding dimensional stability and reliability.
| Property | RO4003C | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.38±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.55 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0027
0.0021 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +40 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 19,650(2,850)
19,450(2,821) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 139(20.2)
100(14.5) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 276
(40) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.3 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 11
14
46 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.71 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.79 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 1.05
(6.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | N/A | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
S1000-2 Features:
S1000-2 materials from Shengyi are lead-free compatible FR-4 laminates known for their high thermal resistance, low CTE, and excellent through-hole reliability. Notable features include:
- High Thermal Resistance and Tg: S1000-2 boasts a high glass transition temperature (Tg) of 170°C (DSC), making it suitable for applications with elevated operating temperatures. It also exhibits excellent UV blocking and AOI compatibility.
- Low Z-Axis CTE: With a low CTE of 45 ppm/°C before Tg, S1000-2 provides exceptional dimensional stability, ensuring reliable performance in various conditions.
- Outstanding Mechanical and Electrical Properties: S1000-2 offers excellent anti-CAF (Conductive Anodic Filament) performance, low water absorption of 0.1%, and reliable through-hole reliability.
Hybrid PCB Construction:
This hybrid PCB combines the benefits of RO4003C and S1000-2 materials to meet specific requirements. RO4003C, known for its high-frequency performance and stability, is strategically used in critical areas such as RF transmission lines and sensitive signal paths. S1000-2, a cost-effective and versatile FR-4 material, is employed in other areas of the PCB where high-frequency performance is not as crucial, such as power distribution and mechanical support. This hybrid design achieves a balance between performance and cost-effectiveness.
PCB Construction and Specifications:
This hybrid PCB features a 6-layer rigid construction, meticulously designed to meet demanding requirements. Here are the key specifications:
- Board Dimensions: The PCB dimensions are precisely maintained at 82.5mm x 66mm (1PCS) with a tolerance of +/- 0.15mm.
- Trace/Space and Hole Size: The minimum trace/space is 4/6 mils, allowing for fine routing. The minimum hole size is 0.35mm, accommodating various component requirements.
- Stackup Configuration: The stackup consists of copper layers, RO4003C and S1000-2 cores, and prepreg layers, providing optimal performance and reliability.
- Finished Board Thickness and Copper Weight: The finished board thickness is 1.1mm, ensuring durability. Each layer has a copper weight of 1oz (1.4 mils), enabling efficient conductivity.
- Via Plating and Surface Finish: The via plating thickness is 20μm, ensuring reliable interconnectivity. The surface finish is immersion gold, providing excellent solderability and corrosion resistance.
- Silkscreen and Solder Mask: The top silkscreen is in white, enhancing component visibility. The bottom silkscreen is not applied. The top and bottom solder masks are in matte green, offering reliable protection.
- Electrical Testing and Quality Standard: Each PCB undergoes a comprehensive 100% electrical test to guarantee optimal functionality. The product complies with the IPC-Class-2 quality standard, ensuring reliability and consistent performance.
Artwork, Availability, and Applications:
This hybrid PCB with RO4003C and S1000-2 materials is compatible with Gerber RS-274-X artwork, ensuring seamless integration into your design workflow. It is readily available worldwide, providing easy accessibility to designers and manufacturers seeking top-tier PCB solutions.
Unlock the full potential of your high-frequency applications with our advanced hybrid PCB. Experience exceptional electrical performance, reliability, and cost-effectiveness by choosing our hybrid solution. Elevate your designs to new heights and enjoy the benefits of both RO4003C and S1000-2 materials.
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Multilayer Hybrid PCB Based on RO4003C and S1000-2 Substrates Immersion Gold Images
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